Thick-film circuits and metallization process

Details Thick-film circuits and metallization process Thick-film circuits and metallization process

1999-06-25

2000-11-21

Jones, Deborah

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

257211, 257750, 257762, 427125, 428637, 428670, 428672, 428681, 428685, 438121, 438453, 438927, B32B 1501, B05D 512

Patent

active

061500410

ABSTRACT:
16 A thick-film circuit (10) includes an electrically conductive substrate (12), such as stainless steel, and a first layer of a gold-rich conductor (15) applied directly thereon. The gold layer is fired in a non-oxidizing atmosphere, such as nitrogen, to ensure a solid mechanical and electrical connection between the gold and the substrate. A next layer of a silver composition (20) containing a first proportion of silver to a conductive metal is directly applied to the gold layer (15). Preferably, the composition (20) includes palladium in equal parts with the silver to achieve a secure mechanical and electrical contact with the gold layer with a minimum resistivity. A silver-rich layer (23) is then applied directly onto the intermediate layer. This silver-rich layer (23) is a composition of silver and the conductive metal in a second proportion greater than the first proportion. In one embodiment, this second proportion is three parts silver to one part palladium by weight. The thick-film stack-up (10) provides a minimum resistance conductive path between electrical components mounted on the silver-rich layer (23) and the conductive substrate (12).

REFERENCES:
patent: 4170471 (1979-10-01), Bailey
patent: 4547436 (1985-10-01), Rellick

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