Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture
Patent
1975-05-30
1977-04-26
Weiffenbach, Cameron K.
Stock material or miscellaneous articles
Structurally defined web or sheet
Including aperture
252514, 252518, 252520, 427 97, 427125, 427126, 427380, 427383A, 428210, 428428, 428446, 428472, 428539, B05D 512, B32B 310
Patent
active
040202062
ABSTRACT:
A thick-film circuit on a ceramic substrate has circuit paths on opposite sides thereof interconnected with one another by through holes in the substrate filled with a paste which includes grains of a refractory material therein. After sintering, a conductive path results which is substantially non-shrinking. The through holes are preferably filled using a device having a pair of resilient doctor blades arranged to form a V-shaped groove therebetween. An amount of such conductive paste is placed in the groove and a substrate with through holes therein is advanced through the V-shaped groove so that the paste is squeezed into the through holes and the flat surfaces of the substrate are wiped clean by the doctor blades.
REFERENCES:
patent: 3401126 (1968-09-01), Miller et al.
patent: 3445210 (1969-05-01), Matsuzaki et al.
patent: 3505134 (1970-04-01), Short
Elmgren, J.A. et al. Thru-hole Metallization in Ceramics, In IBM Technical Bulletin, 17(8):p. 2257. Jan. 1975.
Siemens Aktiengesellschaft
Weiffenbach Cameron K.
LandOfFree
Thick-film circuit on a substrate with through-contacts between does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thick-film circuit on a substrate with through-contacts between , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thick-film circuit on a substrate with through-contacts between will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2087991