Thick film circuit housing assembly design

Details Thick film circuit housing assembly design Thick film circuit housing assembly design

1988-09-19

1992-04-14

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 79, 174 521, H01L 2302, H01L 2312

Patent

active

051052628

ABSTRACT:
A housing and a pressure seal structure for use with a thick film circuit having a pressure sensor and terminals includes a base plate below the thick film circuit, a top housing above the thick film circuit covering the pressure sensor and an intermediate rubber ring between the housing and the thick film circuit. A coupling force is applied between the base plate and the top housing to draw the two together and apply a sealing force to the rubber ring and establish a pressure seal at the rubber ring.

REFERENCES:
patent: 2825014 (1958-02-01), Willemse
patent: 3153750 (1964-10-01), Ackerman
patent: 3382419 (1968-05-01), Boyer et al.
patent: 3443168 (1969-05-01), Camp et al.
patent: 3723836 (1973-03-01), Shekerjian et al.
patent: 3784726 (1974-01-01), Smith et al.
patent: 3808471 (1974-04-01), Grandia
patent: 4249034 (1981-02-01), Fichot et al.
patent: 4688074 (1987-08-01), Iinuma
patent: 4830979 (1989-05-01), Crowe et al.

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