Thick film circuit having conductor composition with coated meta

Details Thick film circuit having conductor composition with coated meta Thick film circuit having conductor composition with coated meta

1997-10-20

1999-07-27

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

Free metal containing

252514, 361771, 174257, H01B 102, H01B 108, H05K 706, H05K 109

Patent

active

059285680

ABSTRACT:
A thick-film conductor paste and thick-film conductors formed therefrom. The conductor paste is composed of metallic particles coated with a barrier layer that reduces leaching and solder diffusion into the conductor, thereby improving the reliability of the conductor-solder bond. The barrier layer may be continuous or discontinuous, and may be applied to some or all of the metallic particles of the conductor paste.

REFERENCES:
patent: 4493789 (1985-01-01), Ueyama et al.
patent: 4521329 (1985-06-01), Siuta et al.
patent: 4906404 (1990-03-01), Suehiro et al.
patent: 5207950 (1993-05-01), Ehrreich
patent: 5294374 (1994-03-01), Martinez et al.
patent: 5415944 (1995-05-01), Kazem-Goudarzi et al.
patent: 5453293 (1995-09-01), Beane et al.
patent: 5716663 (1998-02-01), Capote et al.
patent: 5737191 (1998-04-01), Horiuchi et al.

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