Thick-film circuit element on a ceramic substrate

Details Thick-film circuit element on a ceramic substrate Thick-film circuit element on a ceramic substrate

1991-01-28

1992-12-08

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156298, 156252, 427101, 427102, C03B 2900

Patent

active

051694654

ABSTRACT:
A thick-film switch element includes a high-temperature glass frit fused to a ceramic substrate. A cermet layer having a low-temperature glass matrix is fired in a conventional furnace to sink into the glass frit layer such that the resulting thickness of the switch element layer is approximately equal to the original thickness of the glass frit layer. The exposed surface of the resulting thick-film switch element product is substantially smooth and the joint between the low-temperature cermet layer and the high-temperature glass frit layer is substantially uniform.

REFERENCES:
patent: 4168344 (1979-09-01), Shapiro et al.
patent: 4397915 (1983-08-01), Wahlers et al.
patent: 4771263 (1988-09-01), Crook et al.
patent: 4824694 (1989-04-01), Bosze et al.
patent: 4839775 (1989-06-01), Schnitker et al.
patent: 5024883 (1991-06-01), SinghDeo et al.

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