Thick film circuit board, method of producing the same and...

Details Thick film circuit board, method of producing the same and... Thick film circuit board, method of producing the same and...

2004-04-26

2008-08-26

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

Reexamination Certificate

active

07417318

ABSTRACT:
A thick film circuit board that can be produced at a low cost, a method of producing the same, and an integrated circuit device. A first thick film circuit board has conducting layers of a copper-containing conductor fired at not higher than 750° C., and includes conducting portions formed by using a silver-containing conductor. A second thick film circuit board has conductors that are formed in the through holes so as to close the openings of at least the one side thereof. The thick film circuit board is produced at a low cost and suppresses a drop in electric conductivity when it is in use.

REFERENCES:
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patent: 7042098 (2006-05-01), Harun et al.
patent: 2002/0149312 (2002-10-01), Roberts et al.
patent: 2003/0116857 (2003-06-01), Taniguchi et al.
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patent: 2005/0236177 (2005-10-01), Inagaki et al.
patent: 11-177016 (1999-07-01), None
patent: 2000-312062 (2000-11-01), None

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