Thick film circuit board and method of forming wire bonding elec

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

174257, 174260, 174261, 361771, 428901, B32B 300

Patent

active

060200480

ABSTRACT:
A gold (Au) thick film land constituting a wire bonding electrode is formed by printing and sintering a gold (Au) thick film paste previously added with copper (Cu) to overlap with a copper (Cu) thick film which is formed as a wiring layer on a ceramic substrate. A semiconductor part mounted on the substrate and the gold (Au) thick film land are directly connected by a gold (Au) wire thereby electrically connecting the semiconductor part and the copper (Cu) thick film. In forming the gold (Au) thick film land, the gold (Au) thick film paste previously added with copper (Cu) is used. Therefore, disconnection caused by the Kirkendoll phenomenon is restrained and stable bonding between the copper (Cu) wiring layer and the gold (Au) thick film land can be achieved.

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patent: 4993148 (1991-02-01), Adachi et al.
patent: 5006167 (1991-04-01), Morikawa et al.
patent: 5601675 (1997-02-01), Hoffmeyer et al.
patent: 5709927 (1998-01-01), Miyuse et al.

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