Thick-film circuit arrangement having a ceramic substrate plate

Details Thick-film circuit arrangement having a ceramic substrate plate Thick-film circuit arrangement having a ceramic substrate plate

1988-06-14

1989-06-13

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 235492, 361406, H05K 116

Patent

active

048397750

ABSTRACT:
The invention relates to a thick-film circuit arrangement having an electronic circuit which is constructed on a surface (17) of a ceramic substrate plate (3) and which consists of conductor paths (5), resistors, capacitors and components, in particular integrated switching circuits without a housing, formed according to thick-film technique. This structure has between the electrically conductive structures (5) a sintered, nonconductive paste substantially filling the intermediate spaces between them and both the structures and the interposed pastes are covered by a sintered insulating paste. For concealing the thick-film circuit arrangement from unauthorized access, the following covering construction is carried out:

REFERENCES:
patent: 3564214 (1971-02-01), Cooper
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4434361 (1984-02-01), Meinguss et al.
patent: 4487993 (1984-12-01), Becker
patent: 4593384 (1986-06-01), Kleinjne
patent: 4650923 (1987-03-01), Nishigaki et al.

Affiliated with

Also associated with

Rating

Thick-film circuit arrangement having a ceramic substrate plate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thick-film circuit arrangement having a ceramic substrate plate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thick-film circuit arrangement having a ceramic substrate plate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1281729