Thick film apparatus and method for customizing IC test PCB

Details Thick film apparatus and method for customizing IC test PCB Thick film apparatus and method for customizing IC test PCB

1996-05-22

1998-09-15

Nguyen, Matthew V.

Electric heating

Metal heating

Wire, rod, or bar bonding

B23K 1116

Patent

active

058082590

ABSTRACT:
Methods for customizing printed circuit boards (PCBs) are provided, comprises steps for applying conductive jumper strips between pin pads and power lands or ground planes of the PCB. In all embodiments, basic PC boards are a starting point, and the basic boards are customized by providing jumpers at customer-specified locations. In one embodiment the jumpers are applied through a template by conductive polymer material. In another embodiment jumpers are welded using a gold foil strip and a PCB repair station. In another embodiment, jumpers are transferred to a load board from a laminate wherein jumpers have been cut out in one layer. In yet another embodiment, a load board is covered with a peelable solder mask material except where jumpers are wanted, then electroless or electrode plating techniques are used to plate up jumpers.

REFERENCES:
patent: 4622106 (1986-11-01), Kitagawa
patent: 4627678 (1986-12-01), Biswas
patent: 5358622 (1994-10-01), Korsten
patent: 5465927 (1995-11-01), Chun-Jung
patent: 5526974 (1996-06-01), Gordon et al.

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