THFA/PDP thermoset thick films for printed circuits

Compositions – Electrically conductive or emissive compositions

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427 96, 252514, H01B 100

Patent

active

054645700

ABSTRACT:
The invention includes the discovery that the addition of a thermosetting polymer to a thick-film conductor formulation including a thermoplastic polymer will substantially retard the spreading of the thick-film conductor ink upon firing of the printed conductor. The thermosetting polymer may be from the family of allylic esters, for example poly(diallyl phthalate). The invention also includes the discovery that the thermosetting resin can be dissolved with an organic solvent to form an additive so as to uniformly distribute the thermosetting polymer within the thick-film conductor formulation including the thermoplastic polymers. Preferred organic solvents include alcohols with a weight ratio of thermoset-to-organic solvent ranging from about 1:1.5 to about 1:3.

REFERENCES:
patent: 4529539 (1985-07-01), Monma et al.
patent: 4552687 (1985-11-01), Beacham et al.
patent: 4747966 (1988-05-01), Maeno et al.
patent: 4798686 (1989-01-01), Hocker et al.
patent: 4929388 (1990-05-01), Wessling
patent: 5162087 (1992-11-01), Fukuzawa et al.

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