Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Patent
1989-07-13
1991-02-19
Jacobs, Lewis T.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
524599, 524602, 524605, 524607, 524451, C08K 334, C08K 700, C08K 906, C08L 6700
Patent
active
049945181
ABSTRACT:
Molding compositions, easily shaped into useful articles having improved mechanical properties that are less anisotropic, contain (a) a thermotropic polymer, and (b) an inorganic filler material, such inorganic filler (b) being a crystalline inorganic filler of platelet shape having a mean diameter ranging from 0.5 to 400 .mu.m and a shape factor represented by the ratio: ##EQU1## which ranges from 10 to 90, and such inorganic filler (b) being present in an amount, expressed in % by weight of filler in the combined polymer+filler, ranging from 20% to to 60%, with the proviso that such amount ranges from above 50% to 60% when the mean particle diameter of the filler material is less than 20 .mu.m.
REFERENCES:
patent: 4161470 (1979-07-01), Calundann
patent: 4458039 (1984-07-01), Gickman
patent: 4803235 (1989-02-01), Okada
patent: 4806586 (1989-02-01), Nakai
Molecular Crystals and Liquid Crystals, vol. 157, 1988, pp. 577-596, Gordon and Breach Science Pulbishers S.A., New York, U.S.; T. G. Ryan: "Modification of Main Chain LCP Processability and Properties".
Morin Alain
Quentin Jean-Pierre
Jacobs Lewis T.
Rhone-Poulenc Chimie
Webman E. J.
LandOfFree
Thermotropic polymer/inorganic reinforcing filler molding compos does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermotropic polymer/inorganic reinforcing filler molding compos, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermotropic polymer/inorganic reinforcing filler molding compos will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1144357