Thermostructural composite articles and method for making same

Details Thermostructural composite articles and method for making same Thermostructural composite articles and method for making same

1995-08-25

1998-03-31

Ryan, Patrick

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Rod, strand, filament or fiber

428212, 428245, 428336, 428366, 428367, 428378, 428380, 428384, 428408, 428688, 428689, 428698, C04B 3556, C04B 3576, C03C 1006, C03C 1400

Patent

active

057336555

ABSTRACT:
A thermostructural composite article and a method for making in which the article comprises silicon carbide reinforcing fibers having an oxygen content by weight of not more than about 14% and an average diameter of less than about 20 microns in a refractory matrix at least partially formed by chemical vapor infiltration. The fibers in the composite article of the invention have an end-to-end fiber diameter uniformity ratio of less than about 1.5.

REFERENCES:
patent: 4610917 (1986-09-01), Yamamura et al.
patent: 4752503 (1988-06-01), Thebault
patent: 4778722 (1988-10-01), Yamamura et al.
patent: 4823734 (1989-04-01), Christin
patent: 4837230 (1989-06-01), Chen et al.
patent: 5026604 (1991-06-01), Thebault
patent: 5071679 (1991-12-01), Heraud et al.
patent: 5094901 (1992-03-01), Gray
patent: 5134020 (1992-07-01), Cotteret et al.
Takemi Yamamura et al., Characteristics of a Ceramic Matrix Composite using a Continuous Si-Ti-C-O Fiber, Ceramic Engineering and Science Proceedings, 11, 1648-1660, (1990) Sept./Oct.

Affiliated with

Also associated with

Rating

Thermostructural composite articles and method for making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermostructural composite articles and method for making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermostructural composite articles and method for making same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-50057