Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1979-04-16
1980-11-04
Beck, Shrive P.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
165DIG10, 427405, 427422, 427423, 428937, 4273768, B05D 110
Patent
active
042320569
ABSTRACT:
A method for producing a porous boiling surface with exceptional adhesion qualities and mechanical strength while at the same time maintaining the high degree of open cell porosity required for effective boiling heat transfer wherein a bond coating of pure aluminum is produced using a thermospray gun to melt an aluminum wire and impinge the molten aluminum particles against the metallic substrate in an inert gas stream projected from the gun nozzle located between 2 and 4 inches from the substrate. The bond coating has a porosity of less than 15 percent and a thickness not greater than 4 mils. The nozzle to substrate distance is then increased to 4 to 10 inches and a top coating of pure aluminum is formed having a porosity greater than 18 percent and a thickness of at least four times the thickness of the bond coating.
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patent: 3077659 (1963-02-01), Holzwarth et al.
patent: 3135626 (1964-06-01), Moen et al.
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patent: 3942230 (1976-03-01), Nalband
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patent: 4093755 (1978-06-01), Dahl et al.
Arc Flame Spray System, Process Manual, Metco Inc., Westbury, L.I., N.Y. 1978, pp. 1-26.
Grant Andrew C.
Kern James W.
Beck Shrive P.
Terminello Dominic J.
Union Carbide Corporation
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