Thermosonic palladium lead wire bonding

Details Thermosonic palladium lead wire bonding Thermosonic palladium lead wire bonding

1985-11-04

1987-06-23

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using high frequency vibratory energy

228179, 361421, H01L 21607

Patent

active

046746714

ABSTRACT:
The present invention relates to a thermosonic wire bonding technique for forming high quality wire interconnections in semiconductor devices. The technique includes using palladium or palladium alloy lead wires to form the wire interconnections between the components of a semiconductor device. The technique also includes forming a protective atmosphere about the palladium lead wire during a portion of the bonding process and controlling the stage temperatures used during the bonding process.

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Reliability Criteria of New Low-Cost Materials for Bonding Wires and Substrates, by A. Bischoff et al., IEEE, 1984, pp. 411-417.
Ball Bonding with Low Cost Ultrafine Wires, by A. Bischoff et al., IEEE, 1982, pp. 254-261.

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