Thermosetting resin glues foamable to high density

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

521122, 521128, 521129, 521187, 521188, B32B 326

Patent

active

044030134

ABSTRACT:
A glue foamable to high density comprises an aqueous alkaline thermosetting resin and a surfactant comprising (1) a fatty acid amide of the alkanol-amines or (2) a tertiary amine oxide used in amount sufficient to render the glue foamable to a stable foam having a density of at least 0.5 and a viscosity of from 1,000 to 20,000 centipoises upon being beaten with air. The glue is useful particularly in the manufacture of plywood.

REFERENCES:
patent: 2446429 (1948-08-01), Nelson et al.
patent: 3821337 (1974-06-01), Bunclark et al.
patent: 4208485 (1980-06-01), Nahta

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermosetting resin glues foamable to high density does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermosetting resin glues foamable to high density, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermosetting resin glues foamable to high density will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1592732

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.