Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
2005-05-17
2005-05-17
Tucker, Philip (Department: 1712)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C523S457000, C523S458000, C525S533000, C528S092000, C528S094000, C528S109000, C528S112000, C528S407000, C528S410000, C528S412000
Reexamination Certificate
active
06893736
ABSTRACT:
The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor. Optionally, the inventive composition includes a filler, desirably at least a portion of the filler should have a particle size in the range of 1 to 1,000 nanometers.
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Chem. Abstracts(CAPLUS) Abstract2001:569775,Aug. ,2001.*
Japanese Pat. Office translation of JP'429, produced Jan. 2004.*
D.W. House, et al., The Versatility of Secondary Diamines in Polyurethane and Polyurea Systems (Sep., 1995).
C.P. Wong et al., “High Performance No-Flow Underfills for Low-Test Flip Chip Applications: Material Characterization”,IEEE Transactions on Components, Pack'gand Man'g Tech.—Part A, 21, 3, 450-58 (Sep. 1998).
“Thioplast”, AKCROS Chemicals, Manchester, Great Britain (Undated).
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D.W. House, et al., The Versatility of Secondary Diamines in Polyurethane and Polyurea Systems (Sep., 1995).
C.P. Wong et al., “High Performance No-Flow Underfills for Low-Test Flip Chip Applications: Material Characterization”,IEEE Transactions on Components, Pack'g and Man'g Tech.—Part A, 21, 3, 450-58 (Sep. 1998).
“Thioplast”, AKCROS Chemicals, Manchester, Great Britain (Undated).
“Thiokol LP-3” Construction Adhesives, Adhesives and Sealants, Rohm and Haas, Jan., 2001.
Lee & Neville, “Handbook of Epoxy Resins”, McGraw-Hill Book Co., NY 1967, pp 1-2 and 13-7 to 13-9.
Aylward David E.
Bauman Steven C.
Henkel Corporation
Tucker Philip
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