Thermosetting resin compositions containing maleimide and/or...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

Reexamination Certificate

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C522S168000, C522S170000, C522S173000, C522S176000, C522S060000, C522S061000, C522S100000, C522S143000, C525S282000, C525S205000, C525S322000, C524S439000, C524S506000, C524S850000, C526S262000

Reexamination Certificate

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10865506

ABSTRACT:
In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.

REFERENCES:
patent: 4740830 (1988-04-01), Ketley
patent: 4886842 (1989-12-01), Drain et al.
patent: 06329762 (1994-11-01), None

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