Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...
Reexamination Certificate
2005-02-08
2005-02-08
Seidleck, James J. (Department: 1711)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Polymers from only ethylenic monomers or processes of...
C524S439000, C524S506000, C524S516000, C524S850000, C525S282000, C525S205000, C525S322000, C522S060000, C522S061000, C522S176000, C522S173000, C522S164000
Reexamination Certificate
active
06852814
ABSTRACT:
In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
REFERENCES:
patent: 4323662 (1982-04-01), Oba et al.
patent: 4369302 (1983-01-01), Ikeguchi et al.
patent: 4564663 (1986-01-01), Martin et al.
patent: 4740343 (1988-04-01), Gaku et al.
patent: 4740830 (1988-04-01), Ketley
patent: 4766179 (1988-08-01), De Koning
patent: 4853449 (1989-08-01), Domeier
patent: 4876358 (1989-10-01), Alexander
patent: 4886842 (1989-12-01), Drain et al.
patent: 5358992 (1994-10-01), Dershem et al.
patent: 5359020 (1994-10-01), Bunner et al.
patent: 5364700 (1994-11-01), Domeier
patent: 5380768 (1995-01-01), Cranston et al.
patent: 5405686 (1995-04-01), Portelli et al.
patent: 5442039 (1995-08-01), Hefner, Jr. et al.
patent: 5447988 (1995-09-01), Dershem et al.
patent: 5470920 (1995-11-01), Camberlin et al.
patent: 5475048 (1995-12-01), Jamison et al.
patent: 5483101 (1996-01-01), Shimoto et al.
patent: 5489641 (1996-02-01), Dershem
patent: 5527592 (1996-06-01), Afzali-Ardakani et al.
patent: 5536970 (1996-07-01), Higashi et al.
patent: 5599611 (1997-02-01), Afzali-Ardakani et al.
patent: 0 318 162 (1988-10-01), None
Romenesko, B.,Ball Grid Array&Flip Chip Technologies: Their Histories&Prospects, vol. 19, No. 1, The International Journal of Microcircuits & Electronic Packaging, (1996).
Smith, Mark A., et al, Bismaleimide/Vinyl Ether Matrix Copolymers, pp. 337-338.
Roderick, William, “Deydration of N-(p-Chloropheynl) phthalamic Acid by Acetic and Trifluoroacetic Anhydrides”, vol. 29, pp. 745-747 (1964).
Cotter, Robert, J., et al, “The Synthesis of N-Substituted Isomaleimides”, pp. 10-15, (1960).
Dershem Stephen M.
Osuna, Jr. Jose A.
Patterson Dennis B.
Fitzpatrick ,Cella, Harper & Scinto
Henkel Corporation
McClendon Sanza L.
Seidleck James J.
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