Thermosetting resin compositions

Details Thermosetting resin compositions Thermosetting resin compositions

1992-04-03

1994-04-05

Dean, Ralph H.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525431, 525476, 525502, C08L 6304, C08L 6310

Patent

active

053005880

ABSTRACT:
A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer wherein component (B) and/or (C) has a double bond conjugated with an aromatic group and component (B) and/or (C) has a naphthalene ring. The composition is easily workable and cures to products having improved adhesion, heat resistance, low thermal expansion, and low water absorption.

REFERENCES:
patent: 4130600 (1978-12-01), Zahir et al.
patent: 4816531 (1989-03-01), Young
patent: 4902778 (1990-02-01), Boyd
patent: 4962161 (1990-10-01), Chu et al.
patent: 5006614 (1991-04-01), Itoh et al.
patent: 5070154 (1991-12-01), Shiobara et al.

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