Thermosetting resin compositions

Details Thermosetting resin compositions Thermosetting resin compositions

1993-02-12

1994-08-23

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523466, 525476, 525481, 525484, 525487, 525502, 525534, 528 97, C08G 5940, C08L 6300

Patent

active

053408519

ABSTRACT:
A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.

REFERENCES:
patent: 3329737 (1967-07-01), Smith
patent: 4127615 (1978-11-01), Zahir et al.
patent: 4130600 (1978-12-01), Zahir et al.
patent: 4632966 (1986-12-01), Kanagawa et al.
patent: 4755569 (1988-07-01), Kanagawa et al.
patent: 4902778 (1990-02-01), Boyd
patent: 5087766 (1992-02-01), Kanayama

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