Thermosetting resin composition, resin film, metallic foil...

Details Thermosetting resin composition, resin film, metallic foil... Thermosetting resin composition, resin film, metallic foil...

2006-09-29

2010-06-15

Feely, Michael J (Department: 1796)

Stock material or miscellaneous articles

Composite

Of silicon containing

C428S447000, C428S448000, C428S901000, C525S474000, C524S588000

Reexamination Certificate

active

07736749

ABSTRACT:
A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I):in-line-formulae description="In-line Formulae" end="lead"?R′m(H)kSiX4−(m+k)  (I)in-line-formulae description="In-line Formulae" end="tail"?(wherein X is a hydrolysable and polycondensable group, e.g., a halogen atom (e.g., chlorine or bromine) or —OR; R is an alkyl group of 1 to 4 carbon atoms or an alkyl carbonyl group of 1 to 4 carbon atoms; R′ is a non-reactive group, e.g., an alkyl group of 1 to 4 carbon atoms or an aryl group (e.g., a phenyl group); “k” is 1 or 2; “m” is 0 or 1; and “m+k” is 1 or 2), and further subjecting the resultant product to hydrosilylation reaction with a hydrosilylation agent.

REFERENCES:
patent: 3825618 (1974-07-01), Pepe
patent: 4584342 (1986-04-01), Kondow
patent: 4652618 (1987-03-01), Sumida et al.
patent: 4694040 (1987-09-01), Hashimoto et al.
patent: 4778860 (1988-10-01), Morita et al.
patent: 4954580 (1990-09-01), Zahir
patent: 5002637 (1991-03-01), Toyoshima et al.
patent: 5173359 (1992-12-01), Toyoshima et al.
patent: 5182173 (1993-01-01), Swi
patent: 5432218 (1995-07-01), Mikami et al.
patent: 5438094 (1995-08-01), Fujiki et al.
patent: 5446088 (1995-08-01), Haluska
patent: 5540948 (1996-07-01), Haluska
patent: 5856016 (1999-01-01), Takahashi et al.
patent: 5939472 (1999-08-01), Ito et al.
patent: 5952044 (1999-09-01), Deichmann et al.
patent: 5967906 (1999-10-01), Horiuchi et al.
patent: RE36396 (1999-11-01), Arthur et al.
patent: 6017389 (2000-01-01), Schmidt et al.
patent: 6100408 (2000-08-01), Monkiewicz et al.
patent: 6103836 (2000-08-01), Imashiro et al.
patent: 6107418 (2000-08-01), Mueller
patent: 6197149 (2001-03-01), Kobayashi et al.
patent: 6376923 (2002-04-01), Sumita et al.
patent: 6534187 (2003-03-01), Kron et al.
patent: 6696155 (2004-02-01), Takano et al.
patent: 7166361 (2007-01-01), Baba et al.
patent: 4303570 (1993-08-01), None
patent: 198 05 083 (1999-08-01), None
patent: 0625532 (1994-11-01), None
patent: 59-027945 (1984-02-01), None
patent: 61-275331 (1986-12-01), None
patent: 62-040368 (1987-08-01), None
patent: 63-017927 (1988-01-01), None
patent: 63-230729 (1988-09-01), None
patent: 1-204953 (1989-08-01), None
patent: 3-062845 (1991-03-01), None
patent: 3-287869 (1991-12-01), None
patent: 5-259228 (1993-10-01), None
patent: 6-021593 (1994-01-01), None
patent: 8-311159 (1996-11-01), None
patent: 9-142825 (1997-06-01), None
patent: 9-201529 (1997-08-01), None
patent: 9-202612 (1997-08-01), None
patent: 10-121363 (1998-05-01), None
patent: 11-060951 (1999-03-01), None
patent: 11-106530 (1999-04-01), None
patent: 11-335527 (1999-12-01), None
patent: 97/01595 (1997-01-01), None
English Language Abstract of JP 63-017927.
English language abstract of JP 9-201529.
English language abstract of JP 9-142825.
English language abstract of JP 9-202612.
English language abstract of JP 8-311159.
English language abstract of JP 11-335527.
English language abstract of JP 6-21593.
English language abstract of JP 63-230729.
English language abstract of JP 59-27945.
English language abstract of JP 3-62845.
English language abstract of JP 3-287869.
English language abstract of JP 1-204953.
English language abstract of JP 10-121363.
English language abstract of JP 11-60951.
English language abstract of JP 11-106530.
English language abstract of DE 198 05 083, published Aug. 12, 1999.
English language abstract of JP 61-275331.
English language of IPER for International Application PCT/JP01/02660.
English language abstract of JP 5-259228.

Affiliated with

Also associated with

Rating

Thermosetting resin composition, resin film, metallic foil... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermosetting resin composition, resin film, metallic foil..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermosetting resin composition, resin film, metallic foil... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4159222