Thermosetting resin composition, laminated body using it,...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate

Reexamination Certificate

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C528S094000, C528S099000, C528S100000, C528S125000, C528S310000

Reexamination Certificate

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08067523

ABSTRACT:
It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric characteristics in the GHz band; and a laminate and a circuit board including the thermosetting resin composition.The present invention provides a thermosetting resin composition including an imide oligomer component (A) containing at least one imide oligomer having a specific structure and an epoxy resin component (B) containing at least one epoxy resin. Furthermore, the present invention provides the thermosetting resin composition further including a polyimide resin component (C).

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International Search Report of PCT/JP2005/006897, date of mailing Jul. 19, 2005.
Notification of Transmittal of Translation of the International Preliminary Report on Patentability (Form PCT/IB/338) of International Application No. PCT/JP2005/006897 mailed Nov. 2, 2006 with Forms PCT/IB/373 and PCT/ISA/237.

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