Thermosetting resin composition for semiconductor devices

Details Thermosetting resin composition for semiconductor devices Thermosetting resin composition for semiconductor devices

1996-11-15

1998-03-17

Yoon, Tae

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524413, 524431, 524432, 524442, 524449, 524451, C08K 322

Patent

active

057287635

ABSTRACT:
A semiconductor device obtained by encapsulating a semiconductor element with a thermosetting resin composition comprising a thermosetting resin (Component I) and a hardener (Component II) having the following components III and IV incorporated therein. The semiconductor device is thus provided with a high heat resistance at infrared reflow step and a high flame retardance, showing a drastically enhanced reliability.
(III) A metal hydroxide represented by the following general formula (1):

REFERENCES:
patent: 4885329 (1989-12-01), Tominaga et al.
patent: 4963291 (1990-10-01), Bercaw
Grant & Hackh 's Chemical Dictionary, pp. 369 & 573, Fifth Ed. McGraw-Hill Book Company, 1987.

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