Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate
2007-08-14
2007-08-14
Feely, Michael J. (Department: 1712)
Stock material or miscellaneous articles
Composite
Of epoxy ether
C428S413000, C428S418000, C428S901000, C525S523000, C525S528000, C523S457000, C523S459000, C523S461000, C523S466000
Reexamination Certificate
active
10934851
ABSTRACT:
The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.
REFERENCES:
patent: 6156831 (2000-12-01), Sase et al.
patent: 6162876 (2000-12-01), Yeager et al.
patent: 6245841 (2001-06-01), Yeager et al.
patent: 2006/0167189 (2006-07-01), Mizuno et al.
patent: 63-33505 (1988-02-01), None
patent: 11-21453 (1999-01-01), None
patent: 11-21507 (1999-01-01), None
patent: 11-263940 (1999-09-01), None
patent: 2000-239496 (2000-09-01), None
patent: 2001-214053 (2001-08-01), None
patent: 2001-339130 (2001-12-01), None
patent: 2001-0101310 (2001-11-01), None
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patent: WO 2004/029127 (2004-04-01), None
Machine translation of JP 2000-239496, provided by the JPO website.
Machine translation of JP 11-263940, provided by the JPO website.
Chung Hyuk-Sung
Jeon Bong-Jin
Kim Hyun-Cheol
Koo Eun-Hae
Cantor & Colburn LLP
Feely Michael J.
LG Chem Ltd.
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