Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate
2000-06-27
2002-06-25
Dawson, Robert (Department: 1712)
Stock material or miscellaneous articles
Composite
Of epoxy ether
C523S453000, C525S523000
Reexamination Certificate
active
06410145
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a thermosetting resin composition for build-up method. More precisely, it relates to a thermosetting resin composition for build-up method comprising an epoxy resin, a curing agent for epoxy resin and poly(ether sulfone). In addition, it relates to an insulating material for build-up method and a build-up print circuit board using said thermosetting resin composition.
2. Description of the Related Art
In recent years, a high-density mounting has been demanded as the progress of downsizing, light weighing and thin shaping of electronic apparatuses. By this reason, it has become required in print circuit board not only to minimize circuit patterns but also to reduce diameter of through holes and via holes, and to adopt blind via holes. Increasing attention has been given to build-up print circuit boards obtainable by the build-up method as a product meeting with these requirements. Practical insulating materials for build-up circuit board include a photo-sensitive resin type having merit that a number of via holes, can be formed in one operation by exposure-development step and a thermosetting resin type which allows formation of finer via holes, by using the laser process. In case of photo-sensitive resin type insulating material, there Is a limitation in selection of the photo-sensitive resin which gives a photosensitivity to the resin composition thereof, and there are many know-hows in the exposure-development step. Thus, at present, the thermosetting resin type insulating material is attracting more attention.
Proposed thermosetting resin compositions for use in the thermosetting resin type insulating materials include, in addition to a composition comprising a thermosetting resin alone such as an epoxy resin, a phenoxy resin or the like, a composition comprising a thermosetting resin and a thermoplastic resin. For example, JP-A-7-33991 and JP-A-7-34048 describe a thermosetting resin containing an epoxy resin and a poly(ether sulfone).
When the conventional thermosetting resin composition is used, however, it has been difficult to obtain an insulating material for build-up method which is satisfactory in heat resistance.
The object of the present invention is to provide a thermosetting resin composition for build-up method which gives a cured product excellent in heat resistance, to provide an insulating material for build-up method using said thermosetting resin composition and to provide a build-up print circuit board using said insulating material.
SUMMARY OF THE INVENTION
As the result of extensive studies for solving above described problems, the inventors have found that the above object can be attained by using a composition comprising a specific epoxy resin, a curing agent for epoxy resin and a poly(ether sulfone), thus the present invention has been completed.
That is, the present invention relates to (I) a thermosetting resin composition for build-up method comprising (A) an epoxy resin represented by the formula (1) , (B) a curing agent for epoxy resin, and (C) a poly(ether sulfone),
in the formula, Gly represents glycidyl group; R represents each independently, an alkyl group having 1 to 10 carbons, a cycloalkyl group having 5 to 7 carbons, or a hydrocarbon group having 6 to 20 carbon atoms which contains a cycloalkyl group having 5 to 7 carbons; in represents each independently a numeral of 0 to 4; when i is 2 or more, R may be the same or different from each other; and n represents a repeating number of 1 to 10.
In addition, the present invention relates to (II) an insulating material for build-up method having a resin-containing layer formed by curing the thermosetting resin composition described for above (I).
The present invention also relates to (III) a build-up print circuit board formed by using the insulating material described for above (II).
DETAILED DESCRIPTION OF THE INVENTION
The thermosetting resin composition of the present invention is a thermosetting resin composition for build-up method which contains(A) an epoxy resin represented by formula (I), (B) a curing agent for epoxy resin, and (C) a poly(ether sulfone).
In the present invention, the epoxy resins represented by the formula (1), can be used alone or in combination of two or more. In view of curing property, in the formula, it is preferable that R is methyl, ethyl, propyl (including isomers), butyl (including isomers). cyclopentyl or cyclohexyl; i is a numeral of 0 to 3, and n is a repeating number of 1 to 5. It is more preferable that R is methyl, ethyl, or t-butyl; i is a numeral of 0 to 2, and n is a repeating number of 1 to 3.
The amount of the component (A) can be suitably selected in conjunction with other components and usually 1% by weight or more, preferably 1 to 80% by weight, based on the total amount of (A), (B) and (C) of the composition.
Process for producing the component (A) can be adopted among known processes including, for example, a process in which a phenol compound or its derivative is reacted with an epihalohydrin in the presence of an alkali such as sodium hydroxide.
In the present invention, known compounds can be used as the curing agent for epoxy resin as the component (B). Examples include polyhydric phenol curing agents for epoxy resin such as phenol novolac, cresol novolac, phenol-modified polybutadiene and the like; amine curing agents for epoxy resin such as dicyandiamide, diaminodiphenyl methane, diaminodiphenyl sulfone and the like; acid-anhydride curing agents for epoxy resin such as pyromellitic acid anhydride, trimellitic acid anhydride, benzophenone tetracarboxylic acid dianhydride and the like; and so on. One or more of them can be used. Among them, polyhydric phenol curing agents for epoxy resin such as phenol novolac are preferred from the viewpoint of low water absorption of cured product.
The amount of the component (B) may usually be determined so that the cured product obtained from the thermosetting resin composition of the invention has a high glass transition temperature. For example, a phenol curing agent is used as the component (B), the ratio of the epoxy equivalent of the component (A) and the hydroxyl group equivalent of the component (B) is usually 1:0.8 to 1:1.2, and preferably 1:1. When an amine curing agent is used as the component (B), the ratio of the epoxy equivalent of the component (A) and the amine group equivalent of the component (B) is usually 1:0.6 to 1:1, and preferably 1:0.8. When an acid anhydride curing agent is used as the component (B), the ratio of the epoxy equivalent of the component (A) and the carboxyl group equivalent of the component (B) is usually 1:0.8 to 1:1.2, and preferably 1:1.
The sum of the components (A) and (B) is usually 5 to 90% by weight based on the total amount of the components (A) to (C) of the composition.
In the present invention, known compounds can be used as the poly(ether sulfone) as the component (C). A terminal group of the poly(ether sulfone) molecule includes, for example, a halogen atom, an alkoxy group, a phenolic hydroxyl group and the like. From the viewpoint of solvent resistance and toughness of cured products, a phenolic hydroxyl group is preferred. In this case, it is preferred that the both terminals are phenolic hydroxyl groups. In the poly(ether sulfone) molecule, structural units other than the terminal(s) are not particularly limited.
The amount of the component (C) is usually 10 to 70% by weight based on the total amount of the thermosetting resin composition, and preferably 10 to 50% by weight. When the amount is less than 10% by weight, the toughness of cured products may decrease When the amount exceeds 70% by weight, processability of the composition may lower or the water absorption of cured products may increase.
Known process can be adopted as the processes for producing the component (C). In addition, Examples of commercially available products include Sumika Excel (trademark), manufactured by Sumitomo Chemical Co., Ltd. and REDEL (trademark), manufactured by Amoco Chemical
Hayashi Toshiaki
Nakajima Nobuyuki
Saito Noriaki
Aylward D.
Dawson Robert
Sumitomo Chemical Company Limited
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