Stock material or miscellaneous articles – Composite – Of epoxy ether
Reexamination Certificate
2002-09-25
2004-06-22
Buttner, David J. (Department: 1712)
Stock material or miscellaneous articles
Composite
Of epoxy ether
C428S3550EP, C428S901000, C523S446000, C523S457000, C523S458000, C523S466000, C528S089000, C528S104000
Reexamination Certificate
active
06753086
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a thermosetting resin composition which exhibits excellent curing property and storage stability and advantageously used in the electric and electronic fields, an epoxy resin molding material using the composition and a semiconductor device using the material.
2. Description of Related Art
For electric and electronic materials and, in particular, for sealing materials for semiconductors, improvement in the curing rate has been required to increase production efficiency and improvement in storage stability has been required to improve handling during distribution and storage.
In epoxy resins used in the field of electric and electronic materials, amines, imidazole-based compounds, heterocyclic compounds having nitrogen such as diazabicycloundecene, quaternary ammonium compounds, phosphonium compounds, arsonium compounds and the like various compounds have been used as the curing catalyst.
When amines and, in particular, imidazole-based compounds are used for a sealing material for semiconductors, these compounds cause corrosion of internal wiring under a condition of a high temperature and a high humidity, i.e., these compounds tend to show poor reliability under humid conditions, although these compounds exhibit an excellent curing property. Therefore, the use of the above compounds is not desirable in the field of the electric and electronic materials. Phosphorus-based compounds such as phosphonium compounds are widely used in this field.
Many of the widely used curing catalysts exhibit the effect of accelerating curing even at relatively low temperatures such as the ordinary temperature. This effect causes deterioration in the quality of the resin composition. For example, viscosity increases and fluidity decreases during production and storage and the curing property fluctuates.
To overcome the above problem, so-called latent curing accelerators which suppress the change in viscosity and fluidity at low temperatures with time and exhibit the effect of accelerating curing reaction only under heating during molding have been studied widely. For this purpose, studies for exhibition of the latent property by protecting the active site of a curing accelerator with an ion pair have been conducted. In Japanese Patent Application. Laid-Open No. Heisei 8(1996)-41290, a latent curing accelerator having a salt structure formed with an acid selected from various organic acids and phosphonium ion, is disclosed. However, since this phosphonium salt does not have a specific higher order molecular structure and the ion pair is relatively easily susceptible to the influence of the outside environment, a problem arises in that storage stability decreases when this phosphonium salt is applied to recent sealing materials for semiconductors which uses phenol resin curing agents exhibiting greater mobility of molecules such as low molecular weight epoxy resins and phenol aralkyl resins. In Japanese Patent Application Laid-Open No. 2001-98053, a curing accelerator which is a molecular association compound of a tetrasubstituted phosphonium compound, a compound having at least two phenolic hydroxyl groups in one molecule and a conjugate base of the compound having at least two phenolic hydroxyl groups in one molecule, is disclosed. This molecular association compound corresponds to molecular compound (C) represented by general formula (1) or (2) described in the present invention in which m represents 1, However, this molecular association compound has a problem in that the active site in the reaction is strongly protected by the steric hindrance due to the higher order molecular structure and the curing property decreases although the storage stability is excellent.
SUMMARY OF THE INVENTION
The present invention has an object of providing a thermosetting resin composition which exhibits excellent curing property and storage stability and is advantageously used in the field of electric and electronic materials, an epoxy resin molding material using the composition and a semiconductor device exhibiting excellent reliability under humid conditions.
The present invention provides
[1] A thermosetting resin composition which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule and (C) a molecular compound represented by any one of general formula (1) and general formula (2); general formula (1) being:
wherein P represents phosphorus atom, R
1
, R
2
, R
3
and R
4
each represent a substituted or unsubstituted aromatic group or an alkyl group, A
1
represents a divalent aromatic group, B
1
represents a single bond, a divalent group selected from ether groups, sulfone groups, sulfide groups and carbonyl groups or a divalent organic group having 1 to 13 carbon atoms and m represents a number in a range of 0≦m≦0.75; and general formula (2) being:
wherein P represents phosphorus atom, R
1
, R
2
, R
3
and R
4
each represent a substituted or unsubstituted aromatic group or an alkyl group, A
2
represents a divalent aromatic group and m represents a number in a range of 0≦m≦0.75;
[2] An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule, (C) a molecular compound represented by any one of general formula (1) and general formula (2) and (D) an inorganic filler; general formula (1) being:
wherein P represents phosphorus atom, R
1
, R
2
, R
3
and R
4
each represent a substituted or unsubstituted aromatic group or an alkyl group, A
1
represents a divalent aromatic group, B
1
represents a single bond, a divalent group selected from ether groups, sulfone groups, sulfide groups and carbonyl groups or a divalent organic group having 1 to 13 carbon atoms and m represents a number in a range of 0≦m≦0.75; and general formula (2) being:
wherein P represents phosphorus atom, R
1
, R
2
, R
3
and R
4
each represent a substituted or unsubstituted aromatic group or an alkyl group, A
2
represents a divalent aromatic group and m represents a number in a range of 0≦m≦0.75;
[3] A material described in [2], wherein, in molecular compound (C) represented by any one of general formula (1) and general formula (2), the number represented by m is 0 or 0.5;
[4] A material described in [3], wherein the phenol component in molecular compound (C) represented by general formula (1) is bis(4-hydroxyphenyl) sulfone, 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoro-propane or bis(4-hydroxyphenyl) ether; and
[5] A semiconductor device which comprises a semiconductor element sealed with an epoxy resin molding material described in any one of [2], [3] and [4].
An epoxy resin molding material which exhibits remarkably excellent curing property and storage stability can be obtained in accordance with the present invention described above.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Compound (A) having at least two epoxy groups in one molecule which is used in the present invention is not particularly limited as long as the compound has at least two epoxy groups in one molecule. Examples of compound (A) include epoxy resins and epoxy compounds obtained by reacting epichlorohydrin with hydroxyl group in phenols, phenol resins and naphthols such as epoxy resins of the biphenyl type, epoxy resins of the novolak type and epoxy resins of the naphthalene type; epoxy resins obtained by epoxidation of olefins with peracids such as alicyclic epoxy resins; and compounds obtained by epoxidation of dihydroxybenzenes such as hydroquinone with epichlorohydrin.
Compound (B) having at least two phenolic hydroxyl groups in one molecules works as the curing agent for the compound (A) having at least two epoxy groups in one molecule. Examples of compound (B) inc
Goh Yoshiyuki
Nagata Hiroshi
Buttner David J.
Keehan Christpher
Smith , Gambrell & Russell, LLP
Sumitomo Bakelite Company Ltd.
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