Thermosetting resin composition and use thereof

Details Thermosetting resin composition and use thereof Thermosetting resin composition and use thereof

2006-10-18

2011-12-20

Kugel, Timothy J. (Department: 1765)

Stock material or miscellaneous articles

Composite

Of polyimide

C428S413000, C524S538000, C525S429000, C525S430000

Reexamination Certificate

active

08080319

ABSTRACT:
Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.

REFERENCES:
patent: 4629777 (1986-12-01), Pfeifer
patent: 4937133 (1990-06-01), Watanabe et al.
patent: 5037691 (1991-08-01), Medney et al.
patent: 5268447 (1993-12-01), Tamai et al.
patent: 5677393 (1997-10-01), Ohmori et al.
patent: 6340518 (2002-01-01), Kitahara et al.
patent: 7115681 (2006-10-01), Shimo-Ohsako et al.
patent: 2003/0040578 (2003-02-01), Sugo et al.
patent: 2004/0019174 (2004-01-01), Ichiroku et al.
patent: 2006/0054589 (2006-03-01), Omori et al.
patent: 2009/0286087 (2009-11-01), Tanaka et al.
patent: 2-180980 (1990-07-01), None
patent: 4-345682 (1992-12-01), None
patent: 4-366194 (1992-12-01), None
patent: 5-22399 (1993-03-01), None
patent: 10-733 (1998-01-01), None
patent: 10-81748 (1998-03-01), None
patent: 2000-183239 (2000-06-01), None
patent: 3221756 (2001-08-01), None
patent: 2002-3715 (2002-01-01), None
patent: 2002-289196 (2002-10-01), None
patent: 2003-118054 (2003-04-01), None
patent: 2003-306649 (2003-10-01), None
patent: 2004-35650 (2004-02-01), None
patent: 2004-51794 (2004-02-01), None
patent: 2004-91734 (2004-03-01), None
patent: 2005-82628 (2005-03-01), None
patent: 2005-290327 (2005-10-01), None
patent: 2005-330401 (2005-12-01), None
patent: 2006-82228 (2006-03-01), None
patent: 03/006553 (2003-01-01), None
patent: 2007/046405 (2007-04-01), None
patent: 2007/148666 (2007-12-01), None
International Search Report dated Oct. 28, 2008 in co-pending foreign application (PCT/JP2008/002568).
International Search Report dated Oct. 2, 2007 in co-pending foreign application (PCT/JP2007/062266).
The International Search Report dated Dec. 26, 2006.
Chinese communication dated Jul. 30, 2010 in a co-pending foreign application (CN200780019440.x).
Office Action dated Jun. 23, 2011 in co-pending U.S. Appl. No. 12/308,308.

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