Thermosetting resin composition and use thereof

Details Thermosetting resin composition and use thereof Thermosetting resin composition and use thereof

2005-02-22

2010-11-23

Woodward, Ana L (Department: 1796)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C428S473500, C525S423000, C525S436000

Reexamination Certificate

active

07838114

ABSTRACT:
A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D) containing at least one imidazole.

REFERENCES:
patent: 1281727 (2003-02-01), None
patent: 2-147235 (1990-06-01), None
patent: 2000-109645 (2000-04-01), None
patent: 2001-329246 (2001-11-01), None
patent: 2001-348556 (2001-12-01), None
patent: 2002-047472 (2002-02-01), None
patent: 2004-315754 (2004-11-01), None
English language computer translation of JP 2001-348556, published Dec. 18, 2001, Kanegafuchi Chemical Ind.

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