Thermosetting resin composition and use thereof

Details Thermosetting resin composition and use thereof Thermosetting resin composition and use thereof

2006-07-18

2006-07-18

Feely, Michael J. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of addition polymer from unsaturated monomers

C525S088000, C525S090000, C525S091000, C525S094000, C525S107000, C525S418000, C525S452000, C525S523000, C525S528000, C525S529000, C525S530000, C525S533000

Reexamination Certificate

active

07078106

ABSTRACT:
A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II):wherein R1represents hydrogen, a halogen, or a C1–C5hydrocarbon group; R2represents a halogen or a C1–C5hydrocarbon group; x is0to3;and each of m and n is a natural number; and (2) a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

REFERENCES:
patent: 4780507 (1988-10-01), Gaku et al.
patent: 5091476 (1992-02-01), Monnerat
patent: 6387990 (2002-05-01), Yeager
patent: 6509414 (2003-01-01), Tikart et al.
patent: 6667107 (2003-12-01), Tsuchikawa et al.
European Search Report for EP 02 00 1902, (Jun. 2002).

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