Thermosetting resin composition and semiconductor device...

Details Thermosetting resin composition and semiconductor device... Thermosetting resin composition and semiconductor device...

2005-07-12

2005-07-12

Feely, Michael J. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C438S127000, C523S400000, C523S440000, C525S523000, C525S529000, C525S530000, C525S533000

Reexamination Certificate

active

06916538

ABSTRACT:
A thermosetting resin composition which contains:(A) an epoxy resin having at least two epoxy groups per molecule;(B) a hardener;(C) a compound represented by the following general formula (1) or (2); and(D) a microcapsule type hardening accelerator containing microcapsules each having a structure made up of a core containing a hardening accelerator and a shell covering the core and containing a polymer having a structural unit represented by the following general formula (3), and which, when examined by differential scanning calorimetry at a heating rate of 10° C./min, shows an exothermic peak due to reaction in the range of from 180 to 250° C., anda semiconductor device obtained through sealing with the composition are described.

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European Search Report dated Oct. 8, 2003.

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