Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Reexamination Certificate
2007-04-24
2007-04-24
Smith, Duane (Department: 1724)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
C525S466000, C525S333300, C525S328200, C525S327400, C525S207000, C525S208000, C525S210000, C428S500000, C428S416000, C428S901000, C428S413000, C260S66500B, C260S66500B
Reexamination Certificate
active
10511102
ABSTRACT:
The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.
REFERENCES:
patent: 3046231 (1962-07-01), Comar et al.
patent: 3900444 (1975-08-01), Racky et al.
patent: 3953539 (1976-04-01), Kawase et al.
patent: 4128598 (1978-12-01), Makino et al.
patent: 4777227 (1988-10-01), Wrezel et al.
patent: 6355832 (2002-03-01), Weferling et al.
patent: 6365071 (2002-04-01), Jenewein et al.
patent: 6420459 (2002-07-01), Horold
patent: 6534181 (2003-03-01), Luttrull
patent: 6547992 (2003-04-01), Schlosser et al.
patent: 6667107 (2003-12-01), Tsuchikawa et al.
patent: 2002/0147277 (2002-10-01), Tsuchikawa et al.
patent: 1 024 167 (2000-08-01), None
patent: 1024167 (2000-08-01), None
patent: 49-109476 (1974-10-01), None
patent: 01-221413 (1989-09-01), None
patent: 04-076018 (1992-03-01), None
patent: 04-076019 (1992-03-01), None
patent: 04-088054 (1992-03-01), None
patent: 06-092532 (1994-11-01), None
patent: 06-092533 (1994-11-01), None
patent: 06-092534 (1994-11-01), None
patent: 07-247415 (1995-09-01), None
patent: 07-258537 (1995-10-01), None
patent: 07-268205 (1995-10-01), None
patent: 09-025349 (1997-01-01), None
patent: 10-017685 (1998-01-01), None
patent: 10-017686 (1998-01-01), None
patent: 10-505376 (1998-05-01), None
patent: 2000-508365 (2000-04-01), None
patent: 2000-219775 (2000-08-01), None
patent: 2001-525327 (2001-12-01), None
patent: 2002-161211 (2002-06-01), None
patent: 2002-161211 (2004-06-01), None
patent: WO 97/39053 (1997-10-01), None
patent: WO 99/28327 (1999-06-01), None
International Search Report, completed Jul. 16, 2003, for corresponding International Application No. PCT/JP03/04799.
Taiwanese Office Action (Chinese Language) issued in the counterpart Taiwanese Patent Application of this present application on Aug. 21, 2006.
Arata Michitoshi
Kobayashi Kazuhito
Tomioka Kenichi
Tsuchikawa Shinji
Griffin & Szipl, P.C.
Hitachi Chemical Co. Ltd.
Smith Duane
Wu Ives
LandOfFree
Thermosetting resin composition, and prepreg and laminated... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermosetting resin composition, and prepreg and laminated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermosetting resin composition, and prepreg and laminated... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3755629