Thermosetting resin composition and laminate and process for the

Details Thermosetting resin composition and laminate and process for the Thermosetting resin composition and laminate and process for the

1986-04-22

1988-11-15

Ziegler, Jacob

Stock material or miscellaneous articles

Composite

Of quartz or glass

4284761, 4284763, 525232, 525241, B32B 1710, B32B 2708, B32B 2734

Patent

active

047849177

ABSTRACT:
A thermosetting resin composition comprising as essential constituents (a) a prepolymer comprising a poly(p-hydroxystyrene) derivative represented by the general formula ##STR1## wherein A represents a hydrogen or halogen atom or an alkenyl or alkenoyl group having 2 to 4 carbon atoms, m represents a number in the range of from 1 to 4, and n represents a number in the range of from 1 to 100, and (b) a 1,2-polybutadiene or a derivative thereof. By using this novel resin composition and a customary equipment and procedure, it is easy to obtain a tack-free prepreg which is able to produce laminated materials of low permittivity suitable for use in multilayer printed circuit boards improved in peel strength of bonded copper foil, mechanical strengths, flame retardancy, and heat resistance, as compared to conventional printed circuit boards.

REFERENCES:
patent: 4020225 (1977-04-01), Fujiwara et al.
patent: 4101050 (1978-07-01), Buckler et al.
patent: 4239807 (1980-12-01), Feldmann et al.

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