Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

1998-04-02

2000-05-30

Zirker, Daniel

Stock material or miscellaneous articles

Composite

Of polyimide

428355CN, 428355N, 528310, 528322, C08L 7908, C09J17900, C09J17908

Patent

active

060689323

ABSTRACT:
A thermosetting resin composition for a fixing treatment of electronic parts, which is able to adhere in short time at low temperature, has a heat resistance, is lowly hygroscopic, and hardly produces package cracks, etc.
The thermosetting resin composition comprises polycarbodiimide which is soluble in organic solvents and silicone-modified polyimide which is soluble in organic solvents, which are compounded.

REFERENCES:
patent: 4169866 (1979-10-01), von Bonin et al.
patent: 5576398 (1996-11-01), Takahashi et al.
patent: 5830949 (1998-11-01), Mochizuki et al.
patent: 5859170 (1999-01-01), Sakamoto et al.
D. Lyman et al., "Die Makromolekulare Chemie", Polycarbodiimides and their Derivatives, Band 67, Apr. 1963, pp. 1-8.
T. Campbell et al., "High Polymers Containing the Carbodiimide Repeat Unit", The Journal of Organic Chemistry, vol. 28, No. 8, Aug. 1963, pp. 2069-2075.

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