Thermosetting resin composition

Details Thermosetting resin composition Thermosetting resin composition

1987-05-04

1989-02-28

Ford, John M.

Organic compounds -- part of the class 532-570 series

Organic compounds

Four or more ring nitrogens in the bicyclo ring system

C07D25134

Patent

active

048087173

ABSTRACT:
A thermosetting resin composition comprising (i) a polymaleimide compound having at least two maleimide groups in the molecule and (ii) an s-triazine compound having at least two alkenylaryloxy groups in the molecule; a resin-composition for encapsulant comprising said polymaleimide compound, said triazine compound, and an inorganic filler as essential components; and said s-triazine compound.

REFERENCES:
patent: 4100140 (1978-07-01), Zahir et al.
patent: 4127615 (1978-11-01), Zahir et al.

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