Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From phenol – phenol ether – or inorganic phenolate
Reexamination Certificate
2005-05-03
2005-05-03
Hightower, P. Hampton (Department: 1711)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From phenol, phenol ether, or inorganic phenolate
C528S044000, C528S045000, C528S065000, C528S071000, C528S086000, C528S101000, C528S172000, C528S173000, C528S176000, C528S179000, C528S183000, C528S188000, C528S220000, C528S229000, C528S310000, C528S322000, C528S353000, C525S420000, C525S422000, C525S425000, C525S428000, C525S430000, C525S523000
Reexamination Certificate
active
06887967
ABSTRACT:
A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y). The polyimide resin is obtained by reacting a prepolymer (A) having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound (a1) with a polyol compound (a2) having a linear hydrocarbon structure in which a number-average molecular weight of a linear hydrocarbon structure is from 300 to 6,000, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent.
REFERENCES:
patent: 6162889 (2000-12-01), Orikabe et al.
patent: 6335417 (2002-01-01), Orikabe et al.
patent: 6784275 (2004-08-01), Ichinose et al.
patent: 20030187154 (2003-10-01), Schoenfeld et al.
patent: 10017784 (2001-10-01), None
patent: 1048680 (2000-11-01), None
patent: 55-137161 (1980-10-01), None
patent: 2001-316469 (2001-11-01), None
Sendijarevic et al; “Synthesis and Properties of Urethane-Modified Polyimides”; Journal of Polymer Science Part A: Polymer Chemistry Edition 28 (1990) Dec.; No. 13, pp 3603-15.
European Search Report dated Mar. 13, 2003.
Ichinose Eiju
Ishikawa Hidenobu
Yamashina Yohzoh
Armstrong Kratz Quintos Hanson & Brooks, LLP
Dainippon Ink and Chemicals Inc.
Hampton Hightower P.
LandOfFree
Thermosetting polyimide resin composition process for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermosetting polyimide resin composition process for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermosetting polyimide resin composition process for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3410105