Thermosetting insulating resin paste

Details Thermosetting insulating resin paste Thermosetting insulating resin paste

1988-10-21

1990-07-17

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523457, 523458, 523466, 523442, C08L 6302, C08K 334, C08K 322, C08K 308

Patent

active

049421905

ABSTRACT:
A thermosetting insulating resin paste including 100 parts by weight of an epoxy resin containing a diglycidyl type liquid epoxy resin as a main component and based on the parts by weight of the epoxy resin, 0.5 to 10 parts by weight of dicyandiamide as a setting agent. It further contains 1 to 15 parts by weight of a phenoxy resin, 0.1 to 8 parts by weight of 2-phenyl-4-methyl-5-hydroxymethylimidazole and/or 2-phenyl-4,5-dihydroxymethylimidazole as a setting accelerator as well as 50 to 200 parts by weight of a thermally conductive filler. This insulating resin paste exhibits a long pot life and can be set in a short time at a low temperature without generating any voids during the setting, so that it enables the die bonding process in the production of semiconductor devices to be performed as part of the production line. It also allows a smaller device to be used in this process.

REFERENCES:
patent: 3904813 (1975-09-01), Groff
patent: 4593069 (1986-06-01), Kamagata et al.
patent: 4663190 (1987-05-01), Fujita et al.
Sano, H., "Feature of Die Bonding Epoxy and Die Bonding Techniques", Aug. 7, 1985.

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