Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate
2006-07-10
2010-12-14
Feely, Michael J (Department: 1796)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Processes of preparing a desired or intentional composition...
C523S466000
Reexamination Certificate
active
07851520
ABSTRACT:
The thermosetting epoxy resin composition of the present invention includes an aluminum chelate/silanol curing catalyst system, an epoxy resin, and an anion-trapping agent. The anion-trapping agent is preferably an aromatic phenol derivative or an acid anhydride. Examples include bisphenol S, bisphenol A, bisphenol F, and 4,4′-dihydroxyphenol ether, and acetic anhydride, propionic anhydride, maleic anhydride and phthalic anhydride. The aluminum chelate/silanol curing catalyst system is composed of an aluminum chelator and a silane-coupling agent. The aluminum chelator is preferably a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound. Even when a terminal epoxy resin is contained as the epoxy component of a thermosetting epoxy resin composition containing an aluminum chelate/silanol curing catalyst system, the epoxy resin composition can be configured to cure rapidly at low temperatures without termination of polymerization.
REFERENCES:
patent: 6794038 (2004-09-01), Matsushima
patent: 6831117 (2004-12-01), Matsushima
patent: 6921782 (2005-07-01), Matsushima
patent: 2004/0109943 (2004-06-01), Matsushima et al.
patent: 2004/0109949 (2004-06-01), Matsushima
patent: 2004/0110004 (2004-06-01), Matsushima
patent: 1125488 (2003-10-01), None
patent: A 2002-212537 (2002-07-01), None
patent: A 2002-363255 (2002-12-01), None
patent: A 2002-368047 (2002-12-01), None
patent: A 2003-13036 (2003-01-01), None
patent: A 2006-70051 (2006-03-01), None
Journal of The Chemical Society of Japan, No. 1, pp. 1-14 (1993).
Journal of The Chemical Society of Japan, No. 7, pp. 625-631 (1994).
Feb. 26, 2010 Office Action issued in Chinese Patent Application No. 2006-80025052.8 (with translation).
Feely Michael J
Oliff & Berridg,e PLC
Sony Chemical & Information Device Corporation
Sony Corporation
LandOfFree
Thermosetting epoxy resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermosetting epoxy resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermosetting epoxy resin composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4197210