Thermosetting Encapsulants for electronics packaging

Details Thermosetting Encapsulants for electronics packaging Thermosetting Encapsulants for electronics packaging

1996-12-16

1998-03-10

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 524, 26427217, 26427211, 257788, H01L 2328

Patent

active

057263914

ABSTRACT:
An electronic package is provided where in a semiconductor device on a substrate is encapsulated with a thermally reworkable encapsulant composition including:
(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and
(b) at least one filler present from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable electronic package.

REFERENCES:
patent: 5288769 (1994-02-01), Papageorge et al.
patent: 5371328 (1994-12-01), Gutierrez et al.
patent: 5641856 (1997-06-01), Meurs
"Cleavable Epoxy Resins: Design for Disassembly of a Thermoset," by S. L. Buchwalter and L. L. Kosbar, Journal of PolymerScience: Part A: Polymer Chemistry, vol. 34, pp. 249-260 (1996).

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