Thermosetting die-bonding film

Details Thermosetting die-bonding film Thermosetting die-bonding film

2008-02-04

2010-11-09

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C428S343000, C525S050000, C525S055000, C525S523000, C525S390000, C257SE21599

Reexamination Certificate

active

07829441

ABSTRACT:
A thermosetting die-bonding film having excellent adhesion to an adherent and preferable pickup properties and a dicing die-bonding film having the thermosetting die-bonding film are provided. The thermosetting die-bonding film of the present invention is a thermosetting die-bonding film that is used when manufacturing a semiconductor device and contains 15 to 30% by weight of a thermoplastic resin component and 60 to 70% by weight of a thermosetting resin component as main components, wherein a surface free energy before heat curing is 37 mJ/m2or more and less than 40 mJ/m2.

REFERENCES:
patent: 6323251 (2001-11-01), Perez et al.
patent: 2007/0003758 (2007-01-01), Jin
patent: 2009/0032976 (2009-02-01), Misumi et al.
patent: 60-057342 (1985-04-01), None
patent: 2005-120269 (2005-05-01), None
patent: 2006-261657 (2006-09-01), None
patent: 2006-299226 (2006-11-01), None
International Search Report issued on the corresponding PCT Application No. PCT/JP2008/051772, dated Feb. 26, 2008.

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