Thermosetting die bonding film

Details Thermosetting die bonding film Thermosetting die bonding film

2008-02-29

2009-11-03

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S124000, C438S126000, C257S783000, C257SE21505

Reexamination Certificate

active

07611926

ABSTRACT:
The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pa·s or more and 2500 Pa·s or less at 100° C. before the film is thermally set.

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patent: 2008-103700 (2008-05-01), None

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