Thermosetting aromatic dielectric material

Details Thermosetting aromatic dielectric material Thermosetting aromatic dielectric material

2007-05-01

2007-05-01

Boykin, Terressa (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

C525S080000, C525S181000, C525S185000, C526S072000, C526S335000, C526S336000, C526S337000, C526S340000, C526S346000

Reexamination Certificate

active

11094334

ABSTRACT:
A polymer comprises at least two types of monomer units selected from: (1) diethynyl benzene units, (2) triethynyl benzene units, and (3) ester units. After curing, the polymer may form a condensed polyaromatic dielectric having a dielectric constant of at most 2.0 at 1 MHz, an elastic modulus of at least 7.7 GPa, and a hardness of at least 2.0 GPa.

REFERENCES:
patent: 3882073 (1975-05-01), Cessna, Jr.
patent: 4258079 (1981-03-01), Economy et al.
patent: 4273906 (1981-06-01), Economy et al.
patent: 4592944 (1986-06-01), Clark et al.
patent: 4690962 (1987-09-01), Clark et al.
patent: 6884862 (2005-04-01), Okada et al.
patent: 2003/0099847 (2003-05-01), Cunningham et al.
patent: 095 048 (1983-11-01), None
patent: 2003261682 (2003-09-01), None
Abstracts for Materials Research Society meeting, Spring 2005, published Feb. 28, 2005.
Business Wire, “Chipmakers break low k barrier, Take leap forward to drive next-generation electronics using applied black diamond”., http://www.businesswire.com/cgi-bin/mmg.cgi?eid=4565545, Feb. 4, 2004.
Callstrom, M. R., et al., “Poly[ethynylene(3-n-butyl-2,5-thiophenediyl)-ethynylene]: A soluble polymer containing diacetylene units and its conversion to a highly cross-linked organic solid”., Macromolecules, vol. 21, pp. 3528-3530, (1988).
Dawson, D.J., “Thermally stable polymers for electronic applications”., Reactive Oligomers, ACS Symposium 282, Harris, F.W.; Spinell, H.J. (Eds), Washington D.C., pp. 63-79, (1985).
Economy, J., “High temperature polymers for electronic devices”., Contemporary topics in polymer science., vol. 5, Hg. von E. J. Vandenberg., pp. 351-373, Plenum Press, (1984).
Grovu-Ivanoiu, M., et al., “Electroinitiated polymerization of p-diethynylbenzene”., Makromol. Chem., vol. 186, pp. 2247-2254, (1985).
Hay, A.S., “Oxidative coupling of acetylenes”., J. Org. Chem., vol. 25, pp. 1275-1276, (1960).
Hay, A.S., “Oxidative polymerization of diethynyl compounds”., Journal of Polymer Science, part A-1, vol. 7, pp. 1625-1634, (1969).
Kwock, E.W., et al., “Synthesis and characterization of soluble, high molecular weight poly(aromatic diacetylenes)”., Macromolecules, vol. 26, No. 11, pp. 2935-2940, (1993).
Lammers, D., “IBM may drop low-k materials for advanced ICs”., EE Times, http://www.eetimes.com/showArticle.jhtml?articleID=10801523, Apr. 17, 2003.
Lammers, D., “Worries dull SILK's sheen at IBM Micro”., EE Times, http://www.eetimes.com/showArticle.jhtml?articleID=18308274, Apr. 21, 2003.
Martin, S.J., et al., “Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect”., Advanced Materials, vol. 12, No. 23, pp. 1769-1778, (2000).
Miller, T.M., et al., “Properties and photodefinition of poly(aromatic diacetylenes)”., Chem. Mater., vol. 6, No. 9, pp. 1569-1574, (1994).
Morgen, M., et al., “Low dielectric constant materials for ULSI Interconnects”., Annu. Rev. Mater. Sci., vol. 30, pp. 645-680, (2000).
Oliver, W.C., et al., “An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments”., Journal of Materials Research, vol. 7, No. 6, pp. 1564, (1992).
Peercy, P.S., “The drive to miniaturization”., Nature, vol. 406, pp. 1023-1026, (2000).
Rutherford, D.R., et al., “Poly(2,5-ethynylenethiophenediylethynylenes), related heteroaromatic analogues, and poly(thieno[3,2-b]thiophenes). Synthesis and thermal and electrical properties”., Macromolecules, vol. 25, No. 9, pp. 2294-2306, (1992).
Rutherford, D.R., et al., “Poly(ethynylene-2,5-thiophenediylethynylenes). Processable, reactive polymers that thermally cross-link”., Macromolecules, vol. 21, No. 12, pp. 3530-3532, (1988).
Sematech News, “International Sematech demonstrates ultra low-k material for dual damascene”., http://www.sematech.org/public
ews/releases/20031119.htm., Sematech Inc., (2003).
Wegner, G., “I. Mitt.: Polymerisation von derivaten des 2.4-Hexadiin-1.6-diols im kristallinen zustand”., Z. Naturforschg., vol. 24 b, No. 7, pp. 824-832, (1969).
White, D.M., “Polyacetylenes by oxidative coupling: Synthesis and properties”., Am. Chem. Soc., Div. Polym. Chem., vol. 12, No. 1, pp. 155-161, (1971).
International Search Report dated Sep. 8, 2006 for PCT application No. PCT/US2006/011604.

Affiliated with

Also associated with

Rating

Thermosetting aromatic dielectric material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermosetting aromatic dielectric material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermosetting aromatic dielectric material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3731447