Thermosettable heat-resistant resin compositions

Details Thermosettable heat-resistant resin compositions Thermosettable heat-resistant resin compositions

1985-12-24

1987-11-10

Nielsen, Earl

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525423, 528 99, 528108, 528109, 528113, 528117, 528322, C08G 5944, C08G 5954

Patent

active

047058331

ABSTRACT:
A thermosettable heat-resistant resin composition containing (A) an amino group-terminated imide compound produced by imidating an aromatic diamine with an aromatic tetracarboxylic anhydride at a diamine:anhydride molar ratio of from 1.2:1 to 4:1, and (B) an epoxy resin having at least two epoxy groups, the molar ratio of the amino group of the imide compound to the epoxy group of the epoxy resin being 1:1.6 to 1:2.6.

REFERENCES:
patent: 3346665 (1967-10-01), Schwarzer
patent: 3416994 (1968-12-01), Chalmers et al.
patent: 3639657 (1972-02-01), Moran et al.
patent: 3663651 (1972-05-01), Traut
patent: 4273916 (1981-06-01), Jones
patent: 4277583 (1981-07-01), Waitkus et al.
patent: 4340715 (1982-07-01), Gounder et al.
patent: 4366302 (1982-12-01), Gounder et al.
patent: 4410664 (1983-10-01), Lee
patent: 4487894 (1984-12-01), Lee

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