Thermoplastic semiconductor package and method of producing it

Details Thermoplastic semiconductor package and method of producing it Thermoplastic semiconductor package and method of producing it

1992-11-17

1993-08-31

Coan, James F.

Package making

Methods

With contents treating

53471, 53477, 29827, B65B 3100, H01L 2188

Patent

active

052398064

ABSTRACT:
A semiconductor package includes a lead frame with a die or chip mounted on a die pad, a base made of a thermoplastic material and having a cavity, and a lid made of thermoplastic material ultrasonically welded to the base to cover the cavity and protect the electronic device in the package. The package may include a substrate with conductive traces.
A method of attaching a lid to a semiconductor package base includes the steps of providing a semiconductor package base having an open cavity, providing a thermoplastic lid that covers the open cavity, placing the lid on the semiconductor package base so that the lid covers the open cavity, applying pressure to hold the lid and body together, and attaching the lid to the base by ultrasonically welding them together.

REFERENCES:
patent: 3562058 (1971-02-01), Boyd
patent: 4711700 (1987-12-01), Cusack
patent: 4843695 (1989-07-01), Doe et al.
patent: 5176255 (1993-01-01), Seidler

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