Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1990-11-02
1993-03-16
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
156 731, 437209, 437210, 437215, 437216, 257678, H01L 2302, H01L 2160, B32B 3116
Patent
active
051946955
ABSTRACT:
A semiconductor package includes a lead frame with a die or chip mounted on a die pad, a base made of a thermoplastic material and having a cavity, and a lid made of thermoplastic material ultrasonically welded to the base to cover the cavity and protect the electronic device in the package. The package may include a substrate with conductive traces. A method of attaching a lid to a semiconductor package base includes the steps of providing a semiconductor package base having an open cavity, providing a thermoplastic lid that covers the open cavity, placing the lid on the semiconductor package base so that the lid covers the open cavity, applying pressure to hold the lid and body together, and attaching the lid to the base by ultrasoncially welding them together.
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A. Earley John F.
A. Earley III John F.
AK Technology, Inc.
Ledinh Bot
Picard Leo P.
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