Thermoplastic resin layer chemically bonded to thermoset resin l

Details Thermoplastic resin layer chemically bonded to thermoset resin l Thermoplastic resin layer chemically bonded to thermoset resin l

1989-08-30

1992-02-11

Van Balen, William J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

4283157, 4283193, 4283197, 428409, 428420, B32B 326, B32B 704, B32B 710

Patent

active

050875140

ABSTRACT:
A polymeric resin laminate is manufactured by bonding the molecularly-modified, adhesion-improved surface of a rigid thermoplastic resin layer to a thermoset resin layer, advantageously, in a reaction injection molding operation.

REFERENCES:
patent: Re27430 (1972-07-01), Wimmer
patent: 2515112 (1950-07-01), Burford, III
patent: 3080267 (1963-03-01), Schmalz
patent: 3720540 (1973-03-01), Wimmer
patent: 3859401 (1975-01-01), Gallap et al.
patent: 4053545 (1977-10-01), Fay
patent: 4105734 (1978-08-01), Nakagawa
patent: 4215096 (1980-07-01), Sinha et al.
patent: 4292287 (1981-09-01), Orlett et al.
patent: 4312693 (1982-01-01), Salensky et al.
patent: 4315808 (1982-02-01), Imada et al.
patent: 4317788 (1982-03-01), Imada et al.
patent: 4452679 (1984-06-01), Dunn et al.
patent: 4548867 (1985-10-01), Ueno et al.
patent: 4594231 (1986-06-01), Nishino et al.
patent: 4664982 (1987-05-01), Genovese et al.
patent: 4690097 (1987-09-01), Fukuta et al.
patent: 4714650 (1987-12-01), Obayashi et al.
patent: 4752428 (1988-06-01), Williams et al.
patent: 4771110 (1988-09-01), Bauman et al.
patent: 4784904 (1988-11-01), Wood et al.
patent: 4800053 (1989-01-01), Bauman et al.
patent: 4820580 (1989-04-01), Hocker et al.
patent: 4822652 (1989-04-01), Sempio et al.
patent: 4828871 (1989-05-01), Strobel et al.
patent: 4836901 (1989-06-01), Manabe et al.
patent: 4844944 (1989-07-01), Graefe et al.
patent: 4844955 (1989-07-01), Graefe et al.
patent: 4956224 (1990-09-01), Leca
Coopes et al., "Gas Plasma Treatment of Polymer Surfaces", J. Macromol. Sci.-chem., A17 (2), pp. 217-226 (1982).

Affiliated with

Also associated with

Rating

Thermoplastic resin layer chemically bonded to thermoset resin l does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoplastic resin layer chemically bonded to thermoset resin l, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoplastic resin layer chemically bonded to thermoset resin l will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-781223