Thermoplastic resin composition and moldings of the same

Details Thermoplastic resin composition and moldings of the same Thermoplastic resin composition and moldings of the same

2005-09-20

2005-09-20

Woodward, Ana (Department: 1711)

Compositions

Electrically conductive or emissive compositions

C525S089000

Reexamination Certificate

active

06946084

ABSTRACT:
The present invention provides a thermoplastic resin composition remarkably improved in toughness, particularly, tensile elongation and multiaxial impact strength, while maintaining the flowability and heat resistance of polyamide/polyphenylene ether alloys.A composition comprising a polyamide, a polyphenylene ether and a block copolymer, wherein the block copolymer is a mixture of two or more block copolymers comprising a block copolymer containing a polymer block mainly composed of an aromatic vinyl compound in an amount of 55 weight % or more but less than 90 weight % and a block copolymer containing a polymer block mainly composed of an aromatic vinyl compound in an amount of 20 weight % or more but less than 55 weight %, and one of the polymer block mainly composed of an aromatic vinyl compound in the mixture has a number average molecular weight of 10,000 or more but less than 30,000 and one of the polymer block mainly composed of a conjugated diene compound in the mixture has a number average molecular weight of 50,000 or more but less than 100,000.

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