Thermoplastic polyimide, polyamide acid, and thermally fusible l

Details Thermoplastic polyimide, polyamide acid, and thermally fusible l Thermoplastic polyimide, polyamide acid, and thermally fusible l

1993-12-16

1997-09-16

Seidleck, James J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

528125, 528128, 528170, 528171, 528172, 528173, 528175, 528176, 528183, 528185, 528188, 528220, 528229, 528350, 528352, 4284111, 4284735, C08G 7310

Patent

active

056682476

ABSTRACT:
The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.
The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 to 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

REFERENCES:
patent: 3179630 (1965-04-01), Laszlo
patent: 3179634 (1965-04-01), Edwards
patent: 3505168 (1970-04-01), Dunphy et al.
patent: 3770573 (1973-11-01), Dunphy et al.
patent: 4778872 (1988-10-01), Sasaki et al.
patent: 5070181 (1991-12-01), Kawai et al.
patent: 5260413 (1993-11-01), Ochsner et al.

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