Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Magnetic field
Reexamination Certificate
2008-05-20
2008-05-20
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Magnetic field
C257S226000, C257S444000, C324S345000, C324S377000, C324S219000, C324S160000, C324S173000, C029S712000
Reexamination Certificate
active
07375406
ABSTRACT:
A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.
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Lamb Wayne A.
Michelhaugh Scott E.
Schelonka Peter A.
Stolfus Joel D.
Clark Jasmine J
Honeywell International , Inc.
Lopez Kermit D.
Ortiz Luis M.
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