Thermoplastic mounting of a semiconductor die to a substrate hav

Details Thermoplastic mounting of a semiconductor die to a substrate hav Thermoplastic mounting of a semiconductor die to a substrate hav

1996-08-30

1999-09-28

Meier, Stephen D.

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257444, 257442, H01L 3100

Patent

active

059593407

ABSTRACT:
This invention relates to mounting integrated circuits (IC) to multi-chip modules (MCM) or substrates. More specifically, it provides a method of mounting a semiconductor die such as a thin slice of Mercury Cadmium Telluride (MCT) to a silicon semiconductor substrate, a read-out integrated circuit (ROIC), using a thermoplastic to reduce stress on the MCT caused by mismatched Coefficients of Thermal Expansion (CTE). This process provides for an array of infrared photodetectors on a material such as MCT to be mounted to a read-out integrated circuit (ROIC) using the Vertical Integrated Photodiode (VIP) approach to FPAs, while allowing double sided interdiffusion of CdTe for surface passivation to reduce dark currents and improve performance, without the problems associated with mismatched coefficients of thermal expansion during high temperature processes.

REFERENCES:
patent: 4720738 (1988-01-01), Simmons
patent: 5146303 (1992-09-01), Kornrumpf et al.
patent: 5318666 (1994-06-01), Elkind et al.
patent: 5348607 (1994-09-01), Wojnarowski et al.
patent: 5391604 (1995-02-01), Dietz et al.
patent: 5420445 (1995-05-01), Chisholm et al.
patent: 5608208 (1997-03-01), Nemirovsky
Webster's II New Riverside . . . Dictionary, p. 439 published 1984.

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