Thermoplastic interpolymers and their use in mixtures of polyami

Details Thermoplastic interpolymers and their use in mixtures of polyami Thermoplastic interpolymers and their use in mixtures of polyami

1989-08-07

1991-04-23

Carrillo, Ana L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525 66, 525179, C08L 7700

Patent

active

050101382

ABSTRACT:
The invention relates to thermoplastic interpolymers having a certain chemical composition and to their use in thermoplastic molding compounds of polyamides and styrene copolymers and/or graft polymers for the production of improved blends of polyamides and styrene copolymers and/or graft polymers, particularly ABS polymers, having homogeneous surfaces and improved mechanical properties. The interpolymers themselves are produced by compounding of polyamides and copolymers based on styrenes and/or acrylonitrile and/or (meth)acrylates with primary or secondary alcohols and at least one ester of (meth)acrylic acid with a tertiary C.sub.4-10 alcohol in the melt. The interpolymers act as compatibility promoters in the blends and lead to a surprising improvement in a number of properties of thermoplastic molding compounds.

REFERENCES:
patent: 3700751 (1972-10-01), Mueller et al.
patent: 4246371 (1981-01-01), Meyer et al.
patent: 4338406 (1982-07-01), Sanderson et al.
patent: 4421892 (1983-12-01), Kasahara et al.
patent: 4554320 (1985-11-01), Reimann et al.

Affiliated with

Also associated with

Rating

Thermoplastic interpolymers and their use in mixtures of polyami does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermoplastic interpolymers and their use in mixtures of polyami, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermoplastic interpolymers and their use in mixtures of polyami will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1622012